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WPC 240 automatic cleaner for wafer
- Professional wafer cleaning equipment/camera module, remove the chips, dust on the surface of a CMOS ontology makings
Product description
• remove the chip, CMOS body surface dust particles
Two - fluid spray, high speed centrifugal dehydration
Technical parameters:
Max work: 310mm
Cleaning water supply pressure: >2.0Kgf
Maximum cleaning workpiece: Phi 300MM/310mm
Clean water flow setting range: 4L/min
Cleaning method: water vapor two fluid cleaning
DI supply cleanliness requirement: >16M
Drying method: high speed centrifugal dehydration (ion wind)
Clean compressed air supply pressure: 0.45 - 0.7MPa
Working circling speed range: 0--2800 r/min
Clean compressed air cleanliness requirements: filter degree more than 0.01um/99.5% in ultra clean compressed air, the residual oil is less than 0.1ppm
Centrifugal cleaning release pressure: 1.5 - 13.8kg
Air supply exhaust capacity: 3.0m3/min
Clean compressed air consumption: when cleaning: 210L/MIN
Clean water consumption: when cleaning: 3L/min
Material: 316 stainless steel mirror
Control mode: PLC+ touch screen
Clean the minimum diameter of particles is not less than 1um 99% or above
Power supply: 220V 5A 50/60HZ
Equipment weight: about 160KG
Equipment size: 600mm (L) * 500mm (W) * 1570mm (H)
