SINGLE WAFER SPIN ETCHER

• Fully automatic wafer etching machine, suitable for 3 "/4"/6 "/8"/12 "wafer machines. High recovery and utilization characteristics of chemical liquids.
  Equipped with Bernoulli Robot and Bernoulli Spin Chuck for the fragile nature of thin films, including
  Effectively reduce the fragmentation rate of the wafer process.
  For warped thin sheets, there is a flat chip warping function in the process cavity, which increases the stability of the process.
  Chemical recycling design, combined with recycling rings and ventilation, optimizes the purity and recovery rate of the recovery.
  Friendly software interface, providing safe and convenient chip manufacturing processes for mass production and engineering.