SINGLE WAFER METAL LIFT OFF EOUIPMENT

• A fully automatic wafer photoresist peeling machine with 6 "8" and 12 "Wafer machines, combining batch and single crystal wafer processes to leverage the advantages of single crystal wafer processes.
  Integrated solvent immersion, solvent high-pressure photo blocking removal, and two fluid cleaning.
  The soaking tank is equipped with a megasonic function to enhance the solvent's ability to penetrate into the photoresist, quickly swelling and peeling the photoresist. The application of each function in the process can be determined based on the product characteristics.
  Equipped with dual fluid and high-pressure High-Jet functions, it provides the best photo resistance and particle removal efficiency, maintaining the best cleanliness of the chip.
  Expand modules based on customer process characteristics to achieve optimal production capacity matching, and program control to ensure the same process conditions for each chip.
  Waterproof conveyor robot arm with dual Finger design, suitable for chip transfer between Wet and Wet. Achieve the process goal of Dry in/Dry out. Reduce chemical usage and recycle.