Backside Wafer Etching Machine

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Backside Wafer Etching Machine

Supports 6/8/12-inch wafers in post-thinning etching processes, ideal for handling thin and fragile wafers.
To address the fragility of thin wafers, the equipment is equipped with a Bernoulli Robot and Bernoulli Spin Chuck for non-contact transport and support, minimizing breakage during etching and ensuring wafer safety throughout the process. For warped wafers, it offers a flattening feature to ensure process stability and prevent stress marks from vacuum chucking.
Additionally, the system includes an advanced chemical recycling design with a recovery ring and exhaust system, enhancing chemical purity and recovery rates, reducing costs, and improving environmental sustainability.

产品特点

The equipment precisely controls wafer thickness, ensuring consistency throughout production. For 12-inch wafers, the warp is controlled to exceed 8mm, effectively preventing uneven processing caused by warping.

The equipment is designed for 12-inch wafer processes, ensuring backside silicon etching uniformity within 5%. This significantly improves etching precision and ensures high-quality production.

In large-scale production, the equipment controls the breakage rate to within 100 PPM, significantly reducing waste and improving overall product yield.

The rotary chuck offers high-speed, stable rotation with an adjustable speed range from 10 to 2000 RPM, supporting both forward and reverse rotation. Its anti-static design prevents static interference with the wafers, ensuring stable and safe production.

The equipment features a high-precision chemical temperature control system with a tolerance of ±0.5℃. This ensures consistent chemical temperature throughout the production process, enhancing product quality and stability.

The equipment incorporates a unique design that effectively prevents wafer circuit surface corrosion, significantly improving product yield and ensuring high-quality output during production.

The equipment is equipped with up to three chemical recovery rings, achieving a recovery rate of over 96%. This significantly reduces chemical waste, lowers production costs, and enhances environmental sustainability.

应用范围