Single Wafer Etch & Clean
Equipment Features and Specifications
Supports cleaning and etching for 4/6/8/12-inch wafers, integrating multiple functions such as high-speed centrifugal rotation, high-pressure cleaning, dual-fluid cleaning, brush cleaning, and SC1/SC2 chemical cleaning. It can also include megasonic functionality to meet various process requirements.
This machine is suitable for single wafer FEOL &
BEOL etching and cleaning processes:
- Pre-Clean
- B-Clean
- PR Strip
- Nitride Remove
- Oxide/Poly Recycle
- Metal Etch
- Solvent etc.