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Single Wafer Etch & Clean
Equipment Features and Specifications
Supports cleaning and etching for 4/6/8/12-inch wafers, integrating multiple functions such as high-speed centrifugal rotation, high-pressure cleaning, dual-fluid cleaning, brush cleaning, and SC1/SC2 chemical cleaning. It can also include megasonic functionality to meet various process requirements.
This machine is suitable for single wafer FEOL &
BEOL etching and cleaning processes:
- Pre-Clean
- B-Clean
- PR Strip
- Nitride Remove
- Oxide/Poly Recycle
- Metal Etch
- Solvent etc.
Single Wafer Etch & Clean
产品特点
01
The equipment supports multiple wafer sizes, requiring only a FOUP adapter change for switching. This simplifies operations, enhancing efficiency and significantly improving production line flexibility and changeover speed.
02
Equipped with a pneumatic high-pressure pump, the pressure output can be adjusted from 60 to 200 KG/CM² based on process requirements. Combined with a high-pressure nozzle, this enhances cleaning efficiency and adapts to various cleaning processes.
03
The dual-fluid system maintains pressure control within 5 KG/CM², ensuring precise pressure adjustment during cleaning to prevent damage to wafers while enhancing cleaning effectiveness.
04
The equipment features a stainless steel cleaning solution heating supply tank, efficiently and precisely controlling the spray outlet temperature to ensure optimal dissolution and removal effectiveness of the cleaning solution at high temperatures.
05
The Spin Chuck offers high speed, stability, and anti-static features, reaching up to 3000 RPM. This ensures stable and efficient cleaning of wafers during rotation while preventing static charge buildup that could affect the wafers.
06
The semi-closed chamber design optimizes exhaust performance for optimal vacuum conditions, reducing chemical volatilization and maintaining a clean environment. It includes flow field simulation and a unique sealing structure to ensure the cleanest environment for wafers during cleaning.
07
The simple and intuitive software interface provides a safe and convenient operating experience for mass production processes, effectively enhancing production efficiency and stability.
应用范围
技术参数
Application Scope
This equipment can be used for 4”~ 12” inches wafer particle remove and deflux clean
WPH
≥15pcs/H/Chamber(Base on TT 120s)
Chamber Type
Single wafer spin chamber
Load / Unload
FOUP / SMIF /Cassette
Material
Outside:Stainless Steel;    Structure:Stainless Steel
Chemical
SC1 / SC2 / SPM
Reclaim Cups Quantity
Max. 4 sets
Particle Control
≥0.06um remove rate>97%,or increase≤10ea@≥0.06um
Noise
<75db
严正声明
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深圳市凯尔迪光电科技有限公司

2024年8月07日