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Single Wafer Compound Semiconductor Etch & Clean
Equipment features and specifications:
- Supports 4/6/8/12-inch wafer cleaning and etching processes
- Up to 4 Load Ports
- Up to 12 cleaning chambers (single/double layer)
- Can clean both sides (crystal surface/crystal back)
- Up to 5 groups of different cleaning solutions can be used for cleaning at the same time, such as: DHF, SC1, SC2, BOE, Solvent- Up to 3 recycling rings can be used to recycle waste liquids
This machine is suitable for single wafer FEOL & BEOL etching and cleaning processes:
- Pre-Clean
- B-Clean
- PR Strip
- Nitride Remove
- Oxide/Poly Recycle
- Metal Etch
- Solvent etc
Single Wafer Compound Semiconductor Etch & Clean
产品特点
01
The equipment supports various wafer thicknesses and can tolerate warping up to 6mm. It is suitable for vacuum, edge gripping, or Bernoulli effect transfer and spin holder technology, ensuring stability and safety during the transfer process.
02
Standard etch uniformity is controlled within 3% (intra-wafer/inter-wafer), with the option to optimize uniformity based on process requirements, ensuring compliance with various precision specifications.
03
The equipment features a stainless steel cleaning solution heating supply tank, capable of reaching temperatures up to 95°C. This ensures optimal dissolution and removal effectiveness of the cleaning solution, enhancing cleaning efficiency.
04
Chemical temperature control is accurate to ±0.5°C, maintaining a constant temperature through circulation before spraying, ensuring consistency and reliability in each process.
05
The equipment precisely controls the chemical usage for each wafer, ensuring uniform processing conditions. This is suitable for Wafer Dry-in/Dry-out processes, enhancing production quality consistency.
06
The software interface is simple and user-friendly, offering convenient operation for mass production and engineering processes. It allows users to easily manage process parameters, enhancing production efficiency and precision.
07
The equipment features up to 3 chemical recovery loops, achieving over 97% recovery rate, effectively reducing chemical waste, lowering production costs, and enhancing environmental benefits.
应用范围
技术参数
Wafer Size
4” ~ 12” Silicon UBM、RDL、BGBM、Etching of various metal layers and second and third generation half and half.
WPH
≥15pcs/H/Chamber (Base on TT 180s)
Chamber Type
Single Wafer Spin Chamber
Load / Unload
FOUP / SMIF / Cassette
Wafer clamp
Vacuum / Bernoulli & edge gripe spin chuck
Controller
Touch Panel+IPC+PLC
Noise
<75db
Chamical
Al etch solvent,Cu etch solvent,Ti etch solvent,Si-E,Si-C,Si-D,HNO3/H2SO4/HF acids solvent.
Temperature precision
±0.5℃
严正声明
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深圳市凯尔迪光电科技有限公司

2024年8月07日