Single Wafer Compound Semiconductor Etch & Clean
Equipment features and specifications:
- Supports 4/6/8/12-inch wafer cleaning and etching processes
- Up to 4 Load Ports
- Up to 12 cleaning chambers (single/double layer)
- Can clean both sides (crystal surface/crystal back)
- Up to 5 groups of different cleaning solutions can be used for cleaning at the same time, such as: DHF, SC1, SC2, BOE, Solvent- Up to 3 recycling rings can be used to recycle waste liquids
This machine is suitable for single wafer FEOL & BEOL etching and cleaning processes:
- Pre-Clean
- B-Clean
- PR Strip
- Nitride Remove
- Oxide/Poly Recycle
- Metal Etch
- Solvent etc