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Automated FOUP Cleaner
The fully automatic FOUP cleaning machine is designed for 12-inch production lines and integrates with AMHS crane systems for efficient cleaning and transport. It is ideal for semiconductor applications, including silicon substrates and advanced packaging, meeting strict FOUP/FOSB metal ion and particle cleaning standards.
With a multi-stage high-precision filtration system and various spray combinations for 360° coverage, it ensures thorough cleaning. The built-in vacuum drying and dehumidification system enhances efficiency, meeting low-humidity requirements with optional real-time monitoring.
- Supports EAP/MES/FDC communication protocols, SECS/GEM 200/300
- Compatible with OHT/PGV/AGV systems
- Complies with SEMI S2, 47, and CE standards and certifications
Automated FOUP Cleaner
Automated FOUP Cleaner
产品特点
01
Each chamber operates independently and can be adjusted according to process needs, enhancing production efficiency. The sealed design isolates the chambers from external contaminants, ensuring a continuously clean environment and effectively maintaining FOUP cleanliness after cleaning.
02
The equipment integrates an N2 filling system and humidity detection for the FOUP, allowing continuous monitoring and improvement of environmental conditions to prevent secondary contamination after cleaning.
03
Equipped with an advanced vacuum dehumidification system, it ensures the internal humidity of the FOUP reaches extremely low levels, meeting the stringent humidity control standards of the semiconductor industry.
04
The automatic Load Port design, combined with the E84 sensor, ensures stability and smooth integration with the OHT (automated crane system), automating the entire production process.
05
The optional Slot Mapping system allows real-time monitoring within the FOUP, detecting unremoved wafers and any potential wafer fragments, ensuring production safety and accuracy.
06
The equipment combines an industrial PC and PLC for simple and convenient operation, supporting SECS/GEM communication protocols to meet the intelligent demands of semiconductor production lines.
应用范围
12″ FOSB
12″ FOSB
透明的晶圆出货盒
12″ Wafer FOUP
12″ Wafer FOUP
非透明的半导体晶圆转运盒
技术参数
Equipment size
L4250 x W3110 x H2720 mm
(including foot cup + exhaust port height) for reference only
Scope of application
12”Wafer FOUP/FOSB;Panel FOUP;Mask FOUP
Jig Type
Accroding to customer's wafer carrier(Max. 12inch FOUP)
FPH
≥ 25ea/H(12inch FOUP)
Equipment stability
UP Time >99%;MTBF>2000H;MTBA>168H;MTTR<3H
Particle Control
SP3/SP5 surface scanning Bare Wafer that incease<20ea@0.04um(Except edge 3mm)
Metal ion test
<10PPT(Li, Na, Mg, Al, K, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Sr, Mo, Ba, W, Pb, Au, Ag)IPC-MS test
AMC test
NH3<10ppbv;Total acids<1ppbv;Amines<1ppbv;SO2<1ppbv;VOC<400ppbv
Gross power
MAX. 110KW
Net weight of equipment
About 4000Kg
Main material
Body: Mirror SUS304;  Pipeline: PFA
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深圳市凯尔迪光电科技有限公司

2024年8月07日