Equipment size
L4250 x W3110 x H2720 mm
(including foot cup + exhaust port height) for reference only
Scope of application
12”Wafer FOUP/FOSB;Panel FOUP;Mask FOUP
Jig Type
Accroding to customer's wafer carrier(Max. 12inch FOUP)
FPH
≥ 25ea/H(12inch FOUP)
Equipment stability
UP Time >99%;MTBF>2000H;MTBA>168H;MTTR<3H
Particle Control
SP3/SP5 surface scanning Bare Wafer that incease<20ea@0.04um(Except edge 3mm)
Metal ion test
<10PPT(Li, Na, Mg, Al, K, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Sr, Mo, Ba, W, Pb, Au, Ag)IPC-MS test
AMC test
NH3<10ppbv;Total acids<1ppbv;Amines<1ppbv;SO2<1ppbv;VOC<400ppbv
Net weight of equipment
About 4000Kg
Main material
Body: Mirror SUS304; Pipeline: PFA